Mookam N, Kanlayasiri K. EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE. Suranaree J Sci Technol [internet]. 2026 Aug. 28 [cited 2026 Sep. 11];29(2):010114(1-8). available from: https://ph04.tci-thaijo.org/index.php/SUJST/article/view/15077