N. Mookam and K. Kanlayasiri, “EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE”, Suranaree J Sci Technol, vol. 29, no. 2, pp. 010114(1–8), Aug. 2026.