MOOKAM, N.; KANLAYASIRI, K. EFFECT OF DIPPING SOLDERING ON THICKNESS AND INTERMETALLIC COMPOUND MORPHOLOGY BETWEEN Sn-3.0Cu LEAD-FREE SOLDER AND COPPER SUBSTRATE. Suranaree Journal of Science and Technology, [S. l.], v. 29, n. 2, p. 010114(1–8), 2026. Disponível em: https://ph04.tci-thaijo.org/index.php/SUJST/article/view/15077. Acesso em: 16 sep. 2026.